Study on the Machining Performance of Single Crystal Silicon Wafer Cut by Using Reciprocating Electroplated Diamond Wire Saw Characteristic of Material Removal in Chemical Mechanical Polishing of Silicon Wafer Based on Abrasion Behavior 往复式电镀金刚石线锯切割单晶硅片特性研究基于磨损行为的单晶硅片化学机械抛光材料的去除特性
Study on the Influence of Magnetism of Synthetic Diamond Single Crystal on Their Mechanical Performances Study on the Machining Performance of Single Crystal Silicon Wafer Cut by Using Reciprocating Electroplated Diamond Wire Saw 磁性对人造金刚石单晶机械性能的影响往复式电镀金刚石线锯切割单晶硅片特性研究
In relation to the characteristics of electric reciprocating saw transmission machine, a complete motion sketch has been drawn and equivalent substitution has been done on the sketch. 针对电动往复锯传动机构的特点,完整地绘制了运动简图,并对此运动简图进行了等效代换。
Based on the study of implement mechanism of reciprocating electric micro saw, a kinematic and dynamic model is established. It reckons in friction of joints, actual mass of each rod and actual construction of slide and uses computer and means of numerical value calculating to imitate. 以微型往复式电动锯锯切机构为研究对象,建立了运动学和动力学模型,该模型计入了运动副摩擦、各杆的实际质量及滑块的具体结构,利用数值计算方法进行了计算机模拟。
In this design project, an electric reciprocating saw has been used in the sawing part. The feed system consists of transverse feed ( X orientation), longitudinal feed ( Y orientation) and rotational feed ( C orientation). 在本文的设计方案中,锯切部分采用电动往复锯,进给系统由横向进给(X方向)、纵向进给(Y方向)和转动进给(C向)组成。
The Whole Design and Study of the Numerical Control Curve Reciprocating Saw 数控曲线往复锯的总体设计研究